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Semiconductor packaging substrates play a crucial role in modern electronics, acting as the foundational layer that connects and supports semiconductor devices. These substrates serve as the interface between the delicate silicon chips and the external circuitry, ensuring both mechanical stability and electrical connectivity.
Organic substrates are widely used in applications such as smartphones, tablets, and computers due to their lightweight nature and cost-effectiveness. They are usually composed of epoxy resins reinforced with fiberglass and feature multiple layers of copper traces that enable complex circuit routing. Surface finishing processes, such as electroless copper plating, enhance solderability and prevent oxidation, which is critical for maintaining long-term reliability.